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 Si7440DP
Vishay Siliconix
N-Channel 30-V (D-S) Fast Switching MOSFET
PRODUCT SUMMARY
VDS (V)
30
FEATURES
ID (A)
21 19
rDS(on) (W)
0.0065 @ VGS = 10 V 0.008 @ VGS = 4.5 V
D TrenchFETr Power MOSFET D New Low Thermal Resistance PowerPAKr Package with Low 1.07-mm Profile D 100% Rg Tested
APPLICATIONS
D DC/DC Converters D Optimized for "Low-Side" Synchronous Rectifier Operation
PowerPAK SO-8
D
6.15 mm
S 1 2 3 S S
5.15 mm
G 4
G
D 8 7 6 5 D D D
S N-Channel MOSFET Bottom View
Ordering Information: SI7440DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS
10 secs
30 "20 21
Steady State
Unit
V
12 9 60 A 1.6 1.9 1.2 -55 to 150 W _C
ID IDM IS PD TJ, Tstg
17
4.3 5.4 3.4
THERMAL RESISTANCE RATINGS
Parameter
t v 10 sec Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 71623 S-31728--Rev. B, 18-Aug-03 www.vishay.com Steady State Steady State RthJA RthJC
Symbol
Typical
18 52 1.0
Maximum
23 65 1.3
Unit
_C/W C/W
1
Si7440DP
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain CurrentNO TAG Drain-Source On-State ResistanceNO TAG Forward TransconductanceNO TAG Diode Forward VoltageNO TAG VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 24 V, VGS = 0 V VDS = 24 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 21 A VGS = 4.5 V, ID = 19 A VDS = 15 V, ID = 21 A IS = 4.3 A, VGS = 0 V 40 0.0053 0.0065 65 0.72 1.2 0.0065 0.008 S V 1.0 "100 1 5 V nA mA A W
Symbol
Test Condition
Min
Typ
Max
Unit
DynamicNO TAG
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate-Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 4.3 A, di/dt = 100 A/ms VDD = 15 V, RL = 15 W ID ^ 1 A, VGEN = 10 V, RG = 6 W 0.5 VDS = 15 V, VGS = 4.5 V, ID = 21 A 29.0 10.5 10.0 1.4 18 16 75 41 50 2.2 28 25 180 65 80 ns W 35 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
60 VGS = 10 thru 4 V 60
Transfer Characteristics
50
50
I D - Drain Current (A)
40
I D - Drain Current (A)
40
30 3V 20
30
20
TC = 125_C 25_C -55_C
10
10
0 0 2 4 6 8 10
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
www.vishay.com
2
Document Number: 71623 S-31728--Rev. B, 18-Aug-03
Si7440DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.010 5000
Capacitance
r DS(on) - On-Resistance ( W )
0.008
0.006
C - Capacitance (pF)
VGS = 4.5 V
4000
Ciss
VGS = 10 V
3000
0.004
2000
Coss
0.002
1000
Crss
0.000 0 10 20 30 40 50 60
0 0 4 8 12 16 20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
6 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 21 A 1.8
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 21 A
4
r DS(on) - On-Resistance ( W) (Normalized) 16 24 32 40
5
1.6
1.4
3
1.2
2
1.0
1
0.8
0 0 8
0.6 -50
-25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
0.030 50 0.024
On-Resistance vs. Gate-to-Source Voltage
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
TJ = 150_C 10
ID = 21 A 0.018
0.012
TJ = 25_C
0.006
1 0.0
0.000 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Document Number: 71623 S-31728--Rev. B, 18-Aug-03
www.vishay.com
3
Si7440DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 0.2 -0.0 Power (W) -0.2 -0.4 -0.6 40 -0.8 -1.0 -50 0 -25 0 25 50 75 100 125 150 0.001 0.01 0.1 Time (sec) 1 10 TJ - Temperature (_C) 120 ID = 250 mA 160 V GS(th) Variance (V) 200
Single Pulse Power, Juncion-To-Ambient
80
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05 0.02
t1 t2 1. Duty Cycle, D = t1 t2 PDM
2. Per Unit Base = RthJA = 68_C/W
Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.02 Single Pulse 0.05
0.01 10 - 4 10 - 3 10 - 2 10 - 1 Square Wave Pulse Duration (sec) 1 10
www.vishay.com
4
Document Number: 71623 S-31728--Rev. B, 18-Aug-03


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